About Kennedy Labs
Kennedy Labs is a fabless nanotechnology company creating graphene and graphene like materials for microelectronic applications and novel stand alone devices.
Kennedy Labs uses ALD and CVD production techniques to deposit graphene in situ onto existing in system transitional metals, commonly used for high performance heat sinks or base metal layers of IC packages.
By leveraging on hand substrates to catalyze and host graphene growth, Kennedy Labs enables you to integrate low cost, high performance graphene nanomaterials into your product, thereby increasing system performance and reducing total cost.
Application areas we work in
Materials we are currently depositing on
- Graphene on Copper
- Graphene on Copper Tungsten (CuW)
- Graphene on Tungsten
- Graphene on Molybdenum
- Graphene on Porous Materials
Applications we are targeting
- RF Energy
- GaN and SiC Power
- RF and Microwave
- Thermal Spreaders and Submounts
- High Power Laser Diodes
How to work with us
Through research and development collaborations, hands on product development experimentation and personalized business development consulting, Kennedy Labs can bring the advantages of quantum materials to your industrial application. Please contact Brian Kennedy at firstname.lastname@example.org to initiate discussions.
Brian is focused on the commercialization of advanced nanoscale materials, including graphene, for industrial applications such as microelectronic systems. For 15 years Brian worked in industry and supported a wide range of active, passive and electromechanical suppliers to all industrial verticals in Canada and abroad. In 2013 Brian spent time at the National Research Council of Canada supporting business development initiatives there in advanced materials (gallium nitride on silicon carbide, and graphene). In 2014 Brian left to start up Kennedy Labs.
Dolf obtained a PhD in Molecular and Solid State Physics from the University of Toronto in 1974 and spent two years working as a post-doctoral fellow at the Imperial College of Science and Technology, University of London, U.K.
After spending years in industry (Xerox Research), Dolf moved to Ottawa to join the National Research Council of Canada in Ottawa in 1983. Dolf has co-authored 186 articles and served as Chair of Dialectric Science at the Electrochemical Society (ECS), where he is currently a board member. Dolf's specialties include plasma-enhanced chemical vapour deposition (PECVD), thermal and plasma-enhanced atomic layer deposition (PE-ALD) of high-k dielectrics, plasma etching of insulators and semiconductors, bio-sensors, carbon electronics and high-speed semiconductor devices. After retiring Dolf took up a chief scientist role at Kennedy Labs, and at the Global Center for Advanced Material Research in Industrial Applications (GCAMRIA) in Ottawa.
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